NDLI: A comprehensive sequential yield analysis methodology and the financial payback for higher yields

Content Provider	IEEE Xplore Digital Library
Author	Ross, R. Bailey, J. Atchison, N. Effron, M.
Copyright Year	1999
Description	Author affiliation: Texas Instrum. Inc., Santa Cruz, CA, USA (Ross, R.)
Abstract	One of the highest leverage activities for improving the profitability of manufacturing integrated circuits is probe yield improvement. The cost of manufacturing wafers is the same for low yielding wafers as for high yielding wafers. Increasing the number of good ICs per wafer therefore increases revenue markedly, and most of the increased revenue (except package and final test costs) drops to the bottom line as profit. This paper describes the financial impact of three types of yield improvement activity: (1) overall reduction of the defect density of the manufacturing line; (2) improving the yield of products which fall significantly below the "ideal" yield for a given technology; (3) increasing the rate of yield learning for products designed to new technologies. Calculations of the financial impact of these activities are presented. The paper also describes a powerful method, called Integrated Yield Analysis, for identifying and quantifying all sources of wafer probe yield loss for integrated circuits. Since many IC manufacturers adequately classify and quantify yield loss relating to random defects, this paper emphasizes the accurate calculation of yield limits resulting from systematic causes.
Starting Page	80
Ending Page	86
File Size	527036
Page Count	7
File Format	PDF
ISBN	0780352173
ISSN	10788743
DOI	10.1109/ASMC.1999.798186
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-09-08
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit yield Probes Costs Pulp manufacturing Integrated circuit technology Profitability Integrated circuit manufacture Integrated circuit packaging Circuit testing Product design
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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