NDLI: Lifetime prediction for advanced packaging based on physics of failure approaches on a micro and nano-scale

Content Provider	IEEE Xplore Digital Library
Author	Wunderie, B. Dudek, R. Vogel, D. Michel, B.
Copyright Year	2002
Abstract	Abstract form only given. Lifetime prediction for advanced packaging faces two challenges in the future: lifetime models for the nano-domain (material level) and consistent methodologies for a system approach. Either must incorporate a physics of failure based concept as well as simulative and experimental procedures to analyse failure mechanisms and describe them theoretically on different length scales and level of complexity and along with the necessary degree of detail. This requires new analytical methods on an experimental and computational level on the nano-side of the approach, new complexity-reduction concepts for a physics of failure scale-zooming description on the system side. The paper focuses on new results in the field of failure detection and residual stress measurements on micro-and nano-structures of electronic packages along with different modelling approaches like finite element and force field methods. Based on SAC solders the influence of micro-structure on creep and fatigue performance is demonstrated. Approaches for lifetime models for system reliability are presented describing competing failure mechanisms and are exemplified for flip-chip assemblies and power transistor packages
Starting Page	12
Ending Page	12
File Size	570304
Page Count	1
File Format	PDF
ISBN	1424402603
ISSN	15505723
DOI	10.1109/ISAPM.2006.1665975
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-03-15
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Packaging Failure analysis Force measurement Power system modeling Predictive models Nanostructured materials Computational modeling Analytical models Physics computing Residual stresses
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Battery lifetime prediction for energy-aware computing

Fatigue lifetime prediction of a novel interface material with plastic failure for power electronics packaging

Numerical prediction of residual stresses evolving during packaging of ICs

Measurement of residual stresses in encapsulant of a PQFP

Joint failure prediction of BGAs via failure force mapping

Analytical vs. computational approach of the pull-in voltage of electrostatically actuated micro-bridges

Analyses toward a prediction system for a large-scale volunteer computing system

A prediction model based on neural network and fuzzy Markov chain

A trajectory prediction algorithm based on fuzzy rectification for spinning ball

Lifetime prediction for advanced packaging based on physics of failure approaches on a micro and nano-scale

Similar Documents

Battery lifetime prediction for energy-aware computing

Fatigue lifetime prediction of a novel interface material with plastic failure for power electronics packaging

Numerical prediction of residual stresses evolving during packaging of ICs

Measurement of residual stresses in encapsulant of a PQFP

Joint failure prediction of BGAs via failure force mapping

Analytical vs. computational approach of the pull-in voltage of electrostatically actuated micro-bridges

Analyses toward a prediction system for a large-scale volunteer computing system

A prediction model based on neural network and fuzzy Markov chain

A trajectory prediction algorithm based on fuzzy rectification for spinning ball

Lifetime prediction for advanced packaging based on physics of failure approaches on a micro and nano-scale