NDLI: Adhesion comparison between thermosetting and thermoplastic resin systems based on poly(bisphenol A-co-epichlorohydrin) chemistry

Content Provider	IEEE Xplore Digital Library
Author	Lianhua Fan Wong, C.P.
Copyright Year	2000
Description	Author affiliation: Sch. of Mater. Eng., Georgia Inst. of Technol., Atlanta, GA, USA (Lianhua Fan)
Abstract	The application of the underfill materials has been to enhance the solder joint fatigue life in flip chip assembly, where normally only thermosetting systems have been extensively employed in industry. However, thermoplastics may be of great economic/cost interest as underfill for some low end use microelectronic products; and furthermore, such investigations could enrich our understanding of the potential thermoplastic systems. In this paper both thermosetting and thermoplastic epoxy resins were studied for the feasibility as underfill materials. The former includes basic liquid resin and advanced solid resin of different molecular weight, while the latter is the so-called phenoxy resin. The solution and hot melt approach were taken for the assembly procedure of the die shear strength test at selected solid content and curing/drying condition. The die shear strength of the systems was collected, which could enable us to get insights into the effects of aging, temperature and coupling agent, etc., for the thermosetting and thermoplastic materials.
Starting Page	243
Ending Page	247
File Size	529298
Page Count	5
File Format	PDF
ISBN	0780364600
DOI	10.1109/ADHES.2000.860610
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-06-18
Publisher Place	Finland
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Adhesives Resins Solids Joining materials Soldering Fatigue Flip chip Assembly systems Costs Microelectronics
Content Type	Text
Resource Type	Article

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Thermosetting and thermoplastic bisphenol A epoxy/phenoxy resin as encapsulant material

Adhesion/reliability/reworkability study on underfill material from free radical polymerization system and its hybrid composite with epoxy resin

Investigation on effect of coupling agents in epoxy based underfill material for flip chip application

Encapsulant materials for flip-chip attach

Development of reworkable underfill from hybrid composite of free radical polymerization system and epoxy resin

Adhesion study on underfill encapsulant affected by flip chip assembly variables

Flip chip soldering and adhesive bonding on organic substrates

Adhesion studies of model epoxy systems and commercial underfill resins

Adhesion characterization of no-flow underfills used in flip chip assemblies and correlation with reliability

Adhesion comparison between thermosetting and thermoplastic resin systems based on poly(bisphenol A-co-epichlorohydrin) chemistry

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Thermosetting and thermoplastic bisphenol A epoxy/phenoxy resin as encapsulant material

Adhesion/reliability/reworkability study on underfill material from free radical polymerization system and its hybrid composite with epoxy resin

Investigation on effect of coupling agents in epoxy based underfill material for flip chip application

Encapsulant materials for flip-chip attach

Development of reworkable underfill from hybrid composite of free radical polymerization system and epoxy resin

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Flip chip soldering and adhesive bonding on organic substrates

Adhesion studies of model epoxy systems and commercial underfill resins

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Adhesion comparison between thermosetting and thermoplastic resin systems based on poly(bisphenol A-co-epichlorohydrin) chemistry