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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Pham, A. Laskar, J. Schappacher, J. |
| Copyright Year | 1996 |
| Description | Author affiliation: J Micro Technology, 3744 NW Bluegrass Place, Portland, OR 97229-7068 (Schappacher, J.) || School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250 (Pham, A.; Laskar, J.) |
| Abstract | We present methods for calibrating microstrip devices and circuits using coplanar microprobes and TRL calibration. An on-chip CPW to microstrip transition [1] is employed to measure accurate S-parameters to 50 GHz [1,2]. A CAD model, developed for the transition, is used to de-embed measured results when using a commercial calibration substrate with measurement reference planes at the probe tips. We also make TRL calibration artifacts which include CPW to microstrip transitions in the standards so that we can use the TFX algorithm to de-embed adapters on the ANA. These test methodologies can be used to characterize many types of microstrip devices including printed wire boards and thick film microwave substrates. |
| Starting Page | 85 |
| Ending Page | 94 |
| File Size | 423061 |
| Page Count | 10 |
| File Format | |
| ISBN | 0780356861 |
| DOI | 10.1109/ARFTG.1996.327168 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1996-06-20 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Microstrip Calibration Coplanar waveguides Substrates Circuits Scattering parameters Probes Testing Wire Thick films |
| Content Type | Text |
| Resource Type | Article |
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