NDLI: Incorporation of active RF circuit elements into additively manufactured substrates

Content Provider	IEEE Xplore Digital Library
Author	Ehrenberg, I. Sarma, S. Steffen, T. Bae-Ian Wu
Copyright Year	2015
Description	Author affiliation: Lab. for Manuf. & Productivity, Massachusetts Inst. of Technol., Cambridge, MA, USA (Ehrenberg, I.; Sarma, S.) \|\| Sensors Directorate, Air Force Res. Lab., Wright-Patterson AFB, OH, USA (Steffen, T.; Bae-Ian Wu)
Abstract	Additive Manufacturing processes have matured in recent years and are now being applied to the rapid fabrication of functional electromagnetic structures and devices such as waveguides, antennae, and metamaterials. Key to a successful breakthrough into commercial viability for the industry is the incorporation of active RF elements. In this paper, we note some of the difficulties associated with including active elements within additively manufactured substrate designs, and report measurements from a microstrip transmission line with its transmission tuned by a voltage controlled analog phase shifter embedded within a 3D printed substrate. The results indicate that while active elements can be incorporated, performance could be improved by certain design and fabrication changes.
Sponsorship	IEEE
Starting Page	611
Ending Page	612
File Size	211151
Page Count	2
File Format	PDF
e-ISBN	9781479978151
DOI	10.1109/APS.2015.7304692
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-07-19
Publisher Place	Canada
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Substrates Phase shifters Additives Radio frequency Copper Fabrication Transmission line measurements
Content Type	Text
Resource Type	Article

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