NDLI: A Silicon Platform With MEMS Active Alignment Function and Its Potential Application in Si-Photonics Packaging

Content Provider	IEEE Xplore Digital Library
Author	Qing Xin Zhang Yu Du Chee Wei Tan Jing Zhang Ming Bin Yu Wooi Gan Yeoh Guo-Qiang Lo Dim-Lee Kwong
Copyright Year	1995
Abstract	A silicon (Si) platform, which consists of passive alignment structures (V-grooves), active microelectromechanical systems (MEMS) alignment components, mechanical locking mechanisms, and predeposited gold-tin soldering pads is developed to address the submicron accuracy assembly requirement of the discrete laser diode (LD) to a small core in-chip Si waveguide (WG). A 2-D in situ active alignment of a ball lens in LD-ball lens-Si-WG coupling system is presented here. The 1550-nm DFB LD and the passive Si-photonics chip are attached onto the platform, using flip-chip bonding process. The 2-D alignment of the ball lens is then achieved through the in-plane motion of the suspension arms and the specially designed V-groove. The position of the ball lens is subsequently fixed by the locking mechanism mechanically. MEMS electrothermal V-beam actuators, which can provide large force with a large displacement under a low driving voltage, i.e., >50 ¿m at 25 V are employed in this platform. The effectiveness and stability of the arm locking function have been tested with a shift of <0.1 ¿m after vibration testing (10g , 2 kHz). The integrated aligning and locking functions of the MEMS platform are also demonstrated through the LD-ball lens-Si-WG coupling system. These results show the potential of this MEMS platform in hybrid integrated Si photonics and applications that consist of LD-ball lens-Si-WG coupling system, e.g., the transmitter and transceiver.
Sponsorship	IEEE Lasers and Electro-Optics Society
Starting Page	267
Ending Page	275
Page Count	9
File Size	1983686
File Format	PDF
ISSN	1077260X
Volume Number	16
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon Micromechanical devices Packaging Lenses Testing Microelectromechanical systems Soldering Assembly systems Diode lasers Waveguide components Si photonics Active alignment assembly electrothermal actuation mechanical locking microactuators
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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