NDLI: Local Metamaterial-Based Waveguides in Gaps Between Parallel Metal Plates

Content Provider	IEEE Xplore Digital Library
Author	Kildal, P.-S. Alfonso, E. Valero-Nogueira, A. Rajo-Iglesias, E.
Copyright Year	2002
Abstract	This letter presents a new metamaterial-based waveguide technology referred to as ridge gap waveguides. The main advantages of the ridge gap waveguides compared to hollow waveguides are that they are planar and much cheaper to manufacture, in particular at high frequencies such as for millimeter and sub- millimeter waves. The latter is due to the fact that there are no mechanical joints across which electric currents must float. The gap waveguides have lower losses than microstrip lines, and they are completely shielded by metal so no additional packaging is needed, in contrast to the severe packaging problems associated with microstrip circuits. The gap waveguides are realized in a narrow gap between two parallel metal plates by using a texture or multilayer structure on one of the surfaces. The waves follow metal ridges in the textured surface. All wave propagation in other directions is prohibited (in cutoff) by realizing a high surface impedance (ideally a perfect magnetic conductor) in the textured surface at both sides of all ridges. Thereby, cavity resonances do not appear either within the band of operation. The present letter introduces the gap waveguide and presents some initial simulated results.
Sponsorship	IEEE Antennas and Propagation Society
Starting Page	84
Ending Page	87
Page Count	4
File Size	375183
File Format	PDF
ISSN	15361225
Volume Number	8
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Waveguide discontinuities Surface waves Surface texture Millimeter wave technology Hollow waveguides Planar waveguides Waveguide components Microstrip Packaging Magnetic resonance waveguides Gap waveguides metamaterials millimeter waves submillimeter waves
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Experimental Demonstration of Local Quasi-TEM Gap Modes in Single-Hard-Wall Waveguides

New Microstrip Gap Waveguide on Mushroom-Type EBG for Packaging of Microwave Components

Micromachined circuits for millimeter- and sub-millimeter-wave applications

Flat Lens Antenna using Gap Waveguide Technology at Millimeter Waves

Subwavelength Planar Leaky-Wave Components With Metamaterial Bilayers

Parallel Plate Cavity Mode Suppression in Microstrip Circuit Packages Using a Lid of Nails

Design and Validation of Microstrip Gap Waveguides and Their Transitions to Rectangular Waveguide, for Millimeter-Wave Applications

Gap Waveguide-Based PMC Packaging for via Holes-Caused Nonsmooth PEC Surface

Full-wave modeling of via hole grounds in microstrip by three-dimensional mode matching technique

Local Metamaterial-Based Waveguides in Gaps Between Parallel Metal Plates

Similar Documents

Experimental Demonstration of Local Quasi-TEM Gap Modes in Single-Hard-Wall Waveguides

New Microstrip Gap Waveguide on Mushroom-Type EBG for Packaging of Microwave Components

Micromachined circuits for millimeter- and sub-millimeter-wave applications

Flat Lens Antenna using Gap Waveguide Technology at Millimeter Waves

Subwavelength Planar Leaky-Wave Components With Metamaterial Bilayers

Parallel Plate Cavity Mode Suppression in Microstrip Circuit Packages Using a Lid of Nails

Design and Validation of Microstrip Gap Waveguides and Their Transitions to Rectangular Waveguide, for Millimeter-Wave Applications

Gap Waveguide-Based PMC Packaging for via Holes-Caused Nonsmooth PEC Surface

Full-wave modeling of via hole grounds in microstrip by three-dimensional mode matching technique

Local Metamaterial-Based Waveguides in Gaps Between Parallel Metal Plates