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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Shigue, C.Y. dos Santos, R.G.S. de Abreu, M.M.S.P. Baldan, C.A. Robin, A.L.M. Ruppert-Filho, E. |
| Copyright Year | 2002 |
| Abstract | Dielectric thermal analysis has been proved as a valuable tool for monitoring the epoxy curing process and the related rheological properties in the fabrication of polymer-matrix composite materials. This technique also has the potential to be applied in the monitoring of magnet impregnation processes as well as in quality control. In this work we present the quantitative evaluation of the viscosity changing and the curing kinetics for a commercial Stycast epoxy resin system at different temperatures through the impedance analysis. The results showed correlation between the real component of the complex impedance and the isothermal reaction extent. Comparing the dielectric analysis result with the viscosity measured by rotational rheometer we observed a similar behavior reported for dynamic mechanic analysis. The results comparison have shown that the kinetics parameters obtained from DSC and DETA analysis showed different sensitivities related to the characteristics of curing stages. We concluded that the dielectric thermal analysis should be applied in quantitative evaluation of cure kinetics |
| Sponsorship | Council on Superconductivity Appl. Superconductivity Conference Inc MIT |
| Starting Page | 1786 |
| Ending Page | 1789 |
| Page Count | 4 |
| File Size | 183551 |
| File Format | |
| ISSN | 10518223 |
| Volume Number | 16 |
| Issue Number | 2 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2006-06-01 |
| Publisher Place | U.S.A. |
| Access Restriction | One Nation One Subscription (ONOS) |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Dielectrics Viscosity Kinetic theory Epoxy resins Curing Magnetic analysis Monitoring Impedance Rheology Fabrication viscosity Complex impedance, curing extent degree epoxy curing dielectric analysis thermal analysis |
| Content Type | Text |
| Resource Type | Article |
| Subject | Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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