NDLI: Improving the thermal stability of 1-3 piezoelectric composite transducers

Content Provider	IEEE Xplore Digital Library
Author	Parr, A.C.S. O'Leary, R.L. Hayward, G.
Copyright Year	1986
Abstract	The effect of temperature on the behavior of 1-3 piezoelectric composites manufactured using various polymeric materials was assessed experimentally through electrical impedance analysis and laser vibrometry. Device behavior varied with temperature irrespective of the polymer filler. Most significant changes in the piezoelectric composites were recorded around the glass transition temperature (T/sub g/) of the polymer; movement to lower fundamental resonant frequencies and higher values of electrical impedance minima were observed at higher temperatures. Decoupling of the pillars from the polymer matrix was observed by laser vibrometry at high temperatures. The use of high T/sub g/ polymer extended the operational temperature range of a piezoelectric composite, and a high T/sub g/ polymer with improved thermal conductivity also proved beneficial. For all devices, at temperatures very close to room temperature, subtle changes in device performance, linked to polymer softening were observed. Particulate-filled materials have been investigated, and it is recognized that the high viscosities and low mechanical damping of such materials could be problematic for piezoelectric composite manufacture. The thermal solver of the PZFlex finite element code has been used to predict the temporal and spatial temperature response of a selection of the devices presented. The simulated and experimental data compare favorably.
Starting Page	550
Ending Page	563
Page Count	14
File Size	1305265
File Format	PDF
ISSN	08853010
Volume Number	52
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-04-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal stability Piezoelectric transducers Temperature Polymers Composite materials Piezoelectric materials Manufacturing Impedance Laser transitions Thermal conductivity
Content Type	Text
Resource Type	Article
Subject	Acoustics and Ultrasonics Instrumentation Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Improving the thermal stability of 1-3 piezoelectric composite transducers manufactured using thermally conductive polymeric fillers

Dynamic characteristics of 2-2 piezoelectric composite transducers

Effective electroelastic moduli of 3-3(0-3) piezocomposites

Novel integrated impedance matching layer

Modeling 1-3 composite piezoelectrics: thickness-mode oscillations

Modeling 1-3 composite piezoelectrics: hydrostatic response

Simple model for piezoelectric ceramic/polymer 1-3 composites used in ultrasonic transducer applications

Investigating the thermal stability of 1-3 piezoelectric composite transducers by varying the thermal conductivity and glass transition temperature of the polymeric filler material

Flexible ultrasonic transducers incorporating piezoelectric fibres

Improving the thermal stability of 1-3 piezoelectric composite transducers

Similar Documents

Improving the thermal stability of 1-3 piezoelectric composite transducers manufactured using thermally conductive polymeric fillers

Dynamic characteristics of 2-2 piezoelectric composite transducers

Effective electroelastic moduli of 3-3(0-3) piezocomposites

Novel integrated impedance matching layer

Modeling 1-3 composite piezoelectrics: thickness-mode oscillations

Modeling 1-3 composite piezoelectrics: hydrostatic response

Simple model for piezoelectric ceramic/polymer 1-3 composites used in ultrasonic transducer applications

Investigating the thermal stability of 1-3 piezoelectric composite transducers by varying the thermal conductivity and glass transition temperature of the polymeric filler material

Flexible ultrasonic transducers incorporating piezoelectric fibres

Improving the thermal stability of 1-3 piezoelectric composite transducers