NDLI: Implantable biomimetic microelectronic systems design

Content Provider	IEEE Xplore Digital Library
Author	Wentai Liu Sivaprakasam, M. Guoxing Wang Mingcui Zhou Granacki, J. Lacoss, J. Wills, J.
Copyright Year	1983
Abstract	In this article, design examples will be presented for a biomimetic microelectronic system for a retinal prosthesis that electrically stimulates the retinal neurons. The system replaces the functionality of vision in blind patients affected by retinitis pigmentosa and age-related macular degeneration. The components and signal processing needed for a cortical prosthesis are described. Integration of all the components of a wireless biomimetic microelectronic system, such as input signal conditioning, power telemetry, data telemetry, stimulation amplifier and control circuitry (microstimulator), and a neural recording and processing device, into a single chip or a package is a tremendous challenge, requiring innovative approaches at both circuit and system levels and consideration of the multiple trade-offs between size, power consumption, flexibility in functionality, and reliability of the microelectronics. The chips described in this paper are prototypes for testing their implemented functionalities. The die sizes do not reflect the actual size of the implant. When the microelectronics are finally integrated, the circuits will be optimized to minimize the area. The use of submicron CMOS technology will also help reduce the die area. It should be noted that the biocompatible package encapsulating the electronics will increase the implant size.
Starting Page	66
Ending Page	74
Page Count	9
File Size	1433888
File Format	PDF
ISSN	07395175
Volume Number	24
Issue Number	5
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-09-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Biomimetics Retina Telemetry Packaging Power system reliability Microelectronics Implants CMOS technology Prosthetics Neurons
Content Type	Text
Resource Type	Article
Subject	Biomedical Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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