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Content Provider | IEEE Xplore Digital Library |
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Author | Techaumant, B. Takuma, T. |
Copyright Year | 1965 |
Abstract | This paper applies the method of images, an analytical method, to calculate electric field on conductor particles with a surface film. The method utilizes the multipole re-expansion and appropriate fundamental solutions. Electric field is repetitively calculated so as to satisfy all the boundary conditions. The main advantage over numerical field-calculation methods is that high accuracy can be realized as neither approximation nor discretization of the particle surface or the film thickness is involved. The calculation results for arrangements of a particle chain under a uniform field show the field intensification due to the film thickness and electrical properties. We have also carried out field calculation by the boundary element method (BEM), and compared the results with the analytical ones. The results by the BEM exhibit higher error with decreasing film thickness. Force and yield stress have been calculated from the electric field and compared with experimental results. The comparison shows a good agreement for the ac field, but significant difference for the dc one. |
Sponsorship | IEEE Magnetics Society |
Starting Page | 1388 |
Ending Page | 1391 |
Page Count | 4 |
File Size | 219312 |
File Format | |
ISSN | 00189464 |
Volume Number | 41 |
Issue Number | 5 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2005-05-01 |
Publisher Place | U.S.A. |
Access Restriction | One Nation One Subscription (ONOS) |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Conductive films Erbium Electric fields Conductivity Roads Image analysis Boundary conditions Boundary element methods Stress surface film Dielectrophoretic force electric field electrorheological (ER) fluid method of images particle |
Content Type | Text |
Resource Type | Article |
Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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