NDLI: 3-D construction of monolithic passive components for RF and microwave ICs using thick-metal surface micromachining technology

Content Provider	IEEE Xplore Digital Library
Author	Jun-Bo Yoon Byeong-Il Kim Yun-Seok Choi Yoon, E.
Copyright Year	1963
Abstract	As a viable technological option to address today's strong demands for high-performance monolithic low-cost passive components in RF and microwave integrated circuits (ICs), a new CMOS-compatible versatile thick-metal surface micromachining technology has been developed. This technology enables to build arbitrary three-dimensional (3-D) metal microstructures on standard silicon substrate as post-IC processes at low temperature below 120/spl deg/C. Using this technology, various highly suspended 3-D microstructures have been successfully demonstrated for RF and microwave IC applications. We have demonstrated spiral inductors suspended 100 /spl mu/m over the substrate, coplanar waveguides suspended 50 /spl mu/m over the substrate, and complicated microcoaxial lines, which have 50-/spl mu/m-suspended center signal lines surrounded by inclined ground shields of 100 /spl mu/m in height. The microwave performance of the microcoaxial transmission line fabricated on a glass substrate has been evaluated to achieve very low attenuation of 0.03 dB/mm at 10 GHz with an effective dielectric constant of 1.6. The process variation/manufacturability, mechanical stability, and package issues also have been discussed in detail.
Sponsorship	IEEE Microwave Theory and Techniques Society
Starting Page	279
Ending Page	288
Page Count	10
File Size	2316235
File Format	PDF
ISSN	00189480
Volume Number	51
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2003-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Radio frequency Micromachining Microwave technology CMOS technology Integrated circuit technology Microwave integrated circuits Radiofrequency integrated circuits Microstructure CMOS integrated circuits MMICs
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electrical and Electronic Engineering Radiation

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
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7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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