NDLI: Quantitative classification of adhesive bondline dimensions using Lamb waves and artificial neural networks

Content Provider	IEEE Xplore Digital Library
Author	Todd, C.P.D. Challis, R.E.
Copyright Year	1986
Abstract	Adhesive bonding of metal assemblies is gaining acceptance for use with safety critical structures, and there is a need for effective inspection for both quality assurance (QA) and the assessment of condition in service. One aspect of QA is the need for the dimensions of adhesive bondlines to be within tolerance and measurable. This paper describes the application of ultrasonic Lamb waves in the determination of the principal dimensions of two forms of adhered joints (Lap and T-form) between metal plates. Low order Lamb wave modes (s0 and a1) are propagated across adhered bond-lines, and the received signals are transformed to the modulus frequency domain (FD). The FD data are used as input to artificial neural networks (ANNs), which are trained to associate features in the input data with principal bondline dimensions. The performance of different network structures and simplified forms of these is examined, and the technique gives reliable estimates of the required dimensions in bondlines not included in network training. The interconnected weights of simplified networks provide evidence of the features in Lamb wave signals that underlie the successful operation of the method.
Page Count	15
File Size	1698277
Starting Page	167
Ending Page	181
File Format	PDF
ISSN	08853010
Volume Number	46
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding Artificial neural networks Assembly Inspection Ultrasonic variables measurement Aerospace safety Aerospace materials Physics Frequency domain analysis Automotive engineering
Content Type	Text
Resource Type	Article
Subject	Acoustics and Ultrasonics Instrumentation Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Adhesive joint evaluation by ultrasonic interface and lamb waves

Frequency invariant classification of ultrasonic weld inspection signals

Surface roughness evaluation via ultrasonic scanning

Laser ultrasonic inspection of plates using zero-group velocity lamb modes

Dynamics of an ultrasonic transducer used for wire bonding

On the Measurement of Shock Waves

Ultrasonic high frequency lamb waves for evaluation of plate structures

Ultrasonic guided-waves characterization with warped frequency transforms

Applications of micromachined capacitance transducers in air-coupled ultrasonics and nondestructive evaluation

Quantitative classification of adhesive bondline dimensions using Lamb waves and artificial neural networks

Similar Documents

Adhesive joint evaluation by ultrasonic interface and lamb waves

Frequency invariant classification of ultrasonic weld inspection signals

Surface roughness evaluation via ultrasonic scanning

Laser ultrasonic inspection of plates using zero-group velocity lamb modes

Dynamics of an ultrasonic transducer used for wire bonding

On the Measurement of Shock Waves

Ultrasonic high frequency lamb waves for evaluation of plate structures

Ultrasonic guided-waves characterization with warped frequency transforms

Applications of micromachined capacitance transducers in air-coupled ultrasonics and nondestructive evaluation

Quantitative classification of adhesive bondline dimensions using Lamb waves and artificial neural networks