NDLI: The Packaging of Implantable Integrated Sensors

Content Provider	IEEE Xplore Digital Library
Author	Bowman, Lyn Meindl, James D.
Copyright Year	1964
Abstract	Integrated sensors are being designed for long-term implantation for physiological research using animal models and for permanent implantation for various types of prostheses in clinical applications. The problem of packaging these implantable integrated sensors outside of hermetically sealed hybrid packages is described. The electrolytic corrosion of cable conductors and integrated circuit metallizations is the principal danger. The published performance of the materials which have been used to date to encapsulate nonintegrated sensors and conductors is evaluated, and found to be unreliable for these applications. So, too, are the metals which have been used as electrical conductors. New techniques being developed in the attempt to achieve "hermeticity on a chip" are described. Finally, a critical, residual aspect of the overall problem is identified: how to make a mechanically rugged and inherently noncorrodible connection between a cable and a thin film on a silicon chip. No solution to this problem has been demonstrated.
Sponsorship	IEEE Engineering in Medicine and Biology Society
Page Count	8
File Size	2166458
Starting Page	248
Ending Page	255
File Format	PDF
ISSN	00189294
Volume Number	BME-33
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1986-02-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Conducting materials Integrated circuit packaging Animals Prosthetics Sensor phenomena and characterization Hermetic seals Corrosion Integrated circuit metallization Mechanical cables Semiconductor thin films
Content Type	Text
Resource Type	Article
Subject	Biomedical Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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