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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Larsen, L.E. Moore, R.A. Jacobi, J.H. Halgas, F.A. Brown, P.V. |
| Copyright Year | 1963 |
| Description | A microwave compatible four-terminal electrode design based on hybrid microwave integrated circuit (MIC) construction is presented. The concept of electrothermal matching is employed to prevent artifact in either of two directions: heat sourcing and heat sinking. The electrode system includes a temperature-encoding electronic package. The electrode is designed for use in the brain at a specific insertion depth. It has been tested by thermographic methods for electromagnetic properties at 2450 MHz and a power density of ~250 mW/cm/sup 2/. The system has been thermometrically evaluated for calibration stability and freedom from hysteresis. Stability and artifact has been shown to be within /spl plusmn/15/spl deg/C independent of temperature cycling and/or thermal history. |
| Sponsorship | IEEE Microwave Theory and Techniques Society |
| Starting Page | 673 |
| Ending Page | 679 |
| Page Count | 7 |
| File Size | 2022779 |
| File Format | |
| ISSN | 00189480 |
| Volume Number | 27 |
| Issue Number | 7 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1979-07-01 |
| Publisher Place | U.S.A. |
| Access Restriction | One Nation One Subscription (ONOS) |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Microwave integrated circuits Temperature Electrodes Dielectrics Electromagnetic heating Heat sinks Thermal stability Hybrid integrated circuits Electrothermal effects Electronic packaging thermal management |
| Content Type | Text |
| Resource Type | Article |
| Subject | Condensed Matter Physics Electrical and Electronic Engineering Radiation |
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