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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Hoffman, L. Bacchetta, V. Frederick, K. |
| Copyright Year | 1965 |
| Abstract | The present work studies the time-temperature relationships of adhesion for typical platinum-gold glaze conductors. An empirical equation is derived from which it is possible to calculate the optimum time and temperature of firing. It is shown that the effects of two firings must be taken into account in choosing primary firing conditions. Adhesion was studied as a function of time at elevated temperature, as a function of elevated temperature and humidity and as a function of temperature cycling. Adhesion is degraded by high ambient temperature and humidity through continued reaction with eutectic solder, but life is estimated at 1,000 hours even at 150°C. Conductor films appear insensitive to thermal shock. |
| Starting Page | 381 |
| Ending Page | 386 |
| Page Count | 6 |
| File Size | 576631 |
| File Format | |
| ISSN | 00189502 |
| Volume Number | 1 |
| Issue Number | 1 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1965-06-01 |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Adhesives Glazes Conductors Temperature Firing Humidity Conductive films Equations Thermal degradation Life estimation |
| Content Type | Text |
| Resource Type | Article |
| Subject | Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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