NDLI: Design and Demonstration of Power Delivery Networks With Effective Resonance Suppression in Double-Sided 3-D Glass Interposer Packages

Content Provider	IEEE Xplore Digital Library
Author	Kumar, G. Sitaraman, S. Jonghyun Cho Sundaram, V. Joungho Kim Tummala, R.R.
Copyright Year	2011
Abstract	Ultrathin 3-D glass interposers with throughpackage vias at the same pitch as through-silicon vias (TSVs) have been proposed as a simpler and cheaper alternative to the direct 3-D stacking of logic and memory devices. Such 3-D interposers provide wide-I/O channels for high signal bandwidth (BW) between the logic device on one side of the interposer and memory stack on the other side, without the use of complex TSVs in the logic die. However, this configuration introduces power delivery design challenges due to resonance from: 1) the low-loss property of the glass substrate and 2) the parasitic inductance due to additional length from lateral power delivery path. This paper presents for the first time, the design and demonstration of power delivery networks (PDNs) in 30-μm thin, 3-D double-sided glass interposers, by suppressing the noise from mode resonances. The self-impedance of the 3-D glass interposer PDN was simulated using electromagnetic solvers, including printed-wiring-board and chip-level models. The 3-D PDN was compared with that of the 2-D glass packages having fully populated ball grid array connections. The resonance mechanism for each configuration was studied in detail, and the corresponding PDN loop inductances were evaluated. High impedance peaks in addition to the 2-D PDN were observed at high frequencies (near 7.3 GHz) in the 3-D interposer structure due to the increased inductances from lateral power delivery. This paper proposes and evaluates three important resonance suppression techniques based on: 1) 3-D interposer die configuration; 2) the selection and placement of decoupling capacitors; and 3) 3-D interposer package power and ground stack-up. Two-metal and four-metal layer test vehicles were fabricated on 30and 100-μm thick panel-based glass substrates, respectively, to validate the modeling and analysis of the proposed approach. The PDN test structures were characterized up to 20 GHz for plane resonances and network impedances, with good model-to-hardware correlation. The results in this paper suggest that the ultrathin 3-D interposer PDN structure can be effectively designed to meet the target impedance guidelines for high-BW applications, providing a compelling alternative to 3-D-IC stacking with the TSVs.
Starting Page	87
Ending Page	99
Page Count	13
File Size	7002447
File Format	PDF
ISSN	21563950
Volume Number	6
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2016-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Glass Substrates Impedance Through-silicon vias Silicon Solid modeling Capacitors TSVs. 3-D interposers glass interposers logic memory bandwidth power delivery through-package-vias TSVs
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

Modeling, design, fabrication and characterization of power delivery networks and resonance suppression in double-sided 3-D glass interposer packages

Characteristics of Coupling Capacitance Between Signal-Ground TSVs Considering MOS Effect in Silicon Interposers

Package demonstration of an interposer with integrated TSVs and flexible compliant interconnects

Coaxial through-package-vias (TPVs) for enhancing power integrity in 3D double-side glass interposers

Impact of Copper Through-Package Vias on Thermal Performance of Glass Interposers

Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs

Analysis of Signal Propagation Through TSVs Within Distilled Water for Liquid-Cooled Microsystems

Thermal Characterization of Both Bare Die and Overmolded 2.5-D Packages on Through Silicon Interposers

Design and Demonstration of Power Delivery Networks With Effective Resonance Suppression in Double-Sided 3-D Glass Interposer Packages

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