NDLI: Thermal Fatigue Reliability Analysis and Structural Optimization Based on a Robust Method for Microelectronics FBGA Packages

Content Provider	IEEE Xplore Digital Library
Author	Yi Wan Hailong Huang Pecht, M.
Copyright Year	2001
Abstract	In this paper, we propose a mixed robust method based on three-level and second-order experiment design, the quadric surface, and finite-element analysis to analyze and optimize thermal fatigue reliability of an FBGA package. According to structural characteristics of FBGA packages, six design variables are selected as optimized objects. The equivalent thermal fatigue strain of solder joints of FBGA packages is used as an objective function of thermal fatigue reliability optimization design. Three-level and second-order experiment design was carried out for six design variables, and the equivalent thermal strain of solder joints was calculated by finite-element analysis according to experiment design. Then a quadric surface model of six design variables and the equivalent thermal strain of solder joints was built, and variance analysis and accuracy verification were performed. From the model and significance analysis, the nonlinear relation between design variables and thermal strain of solder joints, and the interaction among design parameters were obtained. Finally, a thermal fatigue robust optimization model was built, and optimum structural parameters and equivalent thermal fatigue strain of solder joints were obtained. Equivalent thermal fatigue strain decreased from 0.01858200 to 0.00951976 and was reduced by 48.77%, as shown by comparing the thermal strains before and after optimization.
Sponsorship	IEEE Electron Devices Society IEEE Reliability Society
Starting Page	206
Ending Page	213
Page Count	8
File Size	1086051
File Format	PDF
ISSN	15304388
Volume Number	15
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Strain Fatigue Robustness Optimization Finite element analysis robust optimization design FBGA package three- level and second- order experiment design quadric surface thermal fatigue reliability three-level and second-order experiment design
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Safety, Risk, Reliability and Quality Electrical and Electronic Engineering

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