NDLI: High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications

Content Provider	IEEE Xplore Digital Library
Author	Decrossas, E. Glover, M.D. Porter, K. Cannon, T. Stegeman, T. Allen-McCormack, N. Hamilton, M.C. Mantooth, H.A.
Copyright Year	2011
Abstract	A new design of stripline transition structures and flip-chip interconnects for high-speed digital communication systems implemented in low-temperature cofired ceramic (LTCC) substrates is presented. Simplified fabrication, suitability for LTCC machining, suitability for integration with other components, and connection to integrated stripline or microstrip interconnects for LTCC multichip modules and system on package make this approach well suited for miniaturized, advanced broadband, and highly integrated multichip ceramic modules. The transition provides excellent signal integrity at high-speed digital data rates up to 28 Gbits/s. Full-wave simulations and experimental results demonstrate a cost-effective solution for a wide frequency range from dc to 30 GHz and beyond. Signal integrity and high-speed digital data rate performances are verified through eye diagram and time-domain reflectometry and time-domain transmissometry measurements over a 10-cm long stripline.
Starting Page	307
Ending Page	313
Page Count	7
File Size	1841249
File Format	PDF
ISSN	21563950
Volume Number	5
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Stripline Transmission line measurements Fabrication Connectors Frequency measurement Time-domain analysis Bit error rate system on package. Full tape thickness feature low-temperature cofired ceramic (LTCC) interconnect multichip module (MCM) quasi-coaxial vertical transition signal integrity system on package
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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