NDLI: An Overview of Process and Product Requirements for Next Generation Thin Film Electronics, Advanced Touch Panel Devices, and Ultra High Barriers

Content Provider	IEEE Xplore Digital Library
Author	Morrison, N.A. Stolley, T. Hermanns, U. Reus, A. Deppisch, T. Bolandi, H. Melnik, Y. Singh, V. Griffith Cruz, J.
Copyright Year	1963
Abstract	Roll-to-Roll (R2R) production of thin film based display components (e.g., active matrix TFT backplanes and touch screens) combine the advantages of the use > of inexpensive, lightweight, and flexible substrates with high throughput production. Significant cost reduction opportunities can also be found in terms of processing tool capital cost, utilized substrate area, and process gas flow when compared with batch processing systems. Applied Materials has developed a variety of different web handling and coating technologies/platforms to enable high volume R2R manufacture of thin film silicon solar cells, TFT active matrix backplanes, touch screen devices, and ultra-high barriers for organic electronics. The work presented in this chapter therefore describes the latest advances in R2R PVD processing and principal challenges inherent in moving from lab and pilot scale manufacturing to high volume manufacturing of flexible display devices using CVD for the deposition of active semiconductors layers, gate insulators, and high performance barrier/passivation layers. This chapter also includes brief description of the process and cost advantage of the use of rotatable PVD source technologies (primarily for use in flexible touch panel manufacture) and a summary of the current performance levels obtained for R2R processed amorphous silicon and IGZO TFT backplanes. Results will also be presented for barrier film for final device/frontplane encapsulation for display applications.
Sponsorship	IEEE Publication
Starting Page	518
Ending Page	534
Page Count	17
File Size	1409410
File Format	PDF
ISSN	00189219
Volume Number	103
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-01-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Substrates Thin film transistors Flexible electronics Coatings Thin film devices Backplanes thin film transistors flexible manufacturing systems lithography
Content Type	Text
Resource Type	Article
Subject	Computer Science Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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