NDLI: Impact of Scattering Within a Multipath Simulator Antenna Array on the Ricean Fading Distribution Parameters in OTA Testing

Content Provider	IEEE Xplore Digital Library
Author	Alayon Glazunov, A. Prasad, S. Handel, P. Bolin, T. Prytz, K.
Copyright Year	1963
Abstract	In this paper, we investigate the unwanted scattering that exists within the multipath simulator (MPS) array antennas employed in over the air (OTA) testing of mobile terminals. The impact of scattering is evaluated in terms of the measurement uncertainty of the average received power and the Ricean K-factor. The maximum ratio combining diversity is investigated for a generic device under test comprising two half-wavelength dipole antennas. We provide closed-form expressions for the uncertainties of the average received power and the Ricean K-factor for a uniform circular array of MPS antennas and a 2-D uniformly distributed angle-of-arrival spectrum. We also derive the maximum number of MPS antennas and the minimum ring radius of the MPS system as a function of the separation between the most distant antenna elements if the device under test employs a uniform linear array. As a result, we provide design guidelines for MPS array in terms of the number antennas, the radius of the MPS array and the wavelength of the carrier frequency.
Sponsorship	IEEE Antennas and Propagation Society
Starting Page	3257
Ending Page	3269
Page Count	13
File Size	2591538
File Format	PDF
ISSN	0018926X
Volume Number	62
Issue Number	6
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Antenna arrays Scattering Arrays Receiving antennas Uncertainty scattering Maximum ratio combining diversity measurement accuracy multipath simulator (MPS) Ricean $K$ -factor
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electrical and Electronic Engineering

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