NDLI: Investigation, Evaluation, and Optimization of Stray Inductance in Laminated Busbar

Content Provider	IEEE Xplore Digital Library
Author	Cai Chen Xuejun Pei Yu Chen Yong Kang
Copyright Year	1986
Abstract	Wiring inductance has a critical effect on electrical, thermal, and electromagnetic compatibility (EMC) performances in inverters. Therefore, the low stray inductance laminated busbar, as a state-of-the-art pathway interface, is widely used in high-power inverters. However, the asymmetrical stray inductances of the laminated busbar may cause different voltage and thermal stresses for semiconductor devices of the same power stage. In order to achieve low and symmetrical stray inductances in the laminated busbar, this paper presents the investigation, evaluation, and optimization of the stray inductances of the laminated busbar. Based on the current commutation loop (CCL) analysis, the investigation of two-layer, three-layer, and multilayer laminated busbars is proposed through three-dimensional (3-D) finite element analysis (FEA) simulations. It can be found that the skin effect, mutual effect, CCL length, CCL separation distance, and split plate significantly influence the stray inductance of laminated busbars. Furthermore, the multilayer laminated busbar structure for multilevel neutral point clamped (NPC) inverter is derived. On the basis of the theoretical analysis, CCL stray inductances of a three-layer laminated busbar are extracted by means of FEA simulation and an improved impedance resonant measurement in a single-phase H-bridge high-power inverter. Insulated gate bipolar transistor (IGBT) voltage overshoot waveforms further validate the stray inductance asymmetry of the laminated busbar. A compromise between the stray inductance and symmetry is proposed in the three-layer laminated busbar. Finally, several feasible guidelines for the optimization of the laminated busbar design are introduced.
Sponsorship	IEEE Power Electronics Society
Starting Page	3679
Ending Page	3693
Page Count	15
File Size	2324714
File Format	PDF
ISSN	08858993
Volume Number	29
Issue Number	7
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Inductance Inverters Analytical models Mathematical model Insulation Capacitors Insulated gate bipolar transistors laminated busbar Current commutation loop (CCL) finite element analysis (FEA) impedance resonant
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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