NDLI: A Phase-Leg Power Module Packaged With Optimized Planar Interconnections and Integrated Double-Sided Cooling

Content Provider	IEEE Xplore Digital Library
Author	Zhenxian Liang Puqi Ning Wang, F. Marlino, L.
Copyright Year	2013
Abstract	A multilayer planar interconnection structure was used for the packaging of liquid-cooled automotive power modules. The power semiconductor switch dies are sandwiched between two symmetric substrates, providing planar electrical interconnections and insulation. Two minicoolers are directly bonded to the outside of these substrates, allowing double-sided, integrated cooling. The power switch dies are orientated in a face-up/face-down 3-D interconnection configuration to form a phase leg. The bonding areas between the dies and substrates, and the substrates and coolers are designed to use identical materials and are formed in one heating process. A special packaging process has been developed so that high-efficiency production can be implemented. Incorporating high-efficiency cooling and low-loss electrical interconnections allows dramatic improvements in systems' cost, and electrical conversion efficiency. These features are demonstrated in a planar bond-packaged prototype of a 200 A/1200 V phase-leg power module made of silicon (Si) insulated gate bipolar transistor and PiN diodes.
Starting Page	443
Ending Page	450
Page Count	8
File Size	2472535
File Format	PDF
ISSN	21686777
Volume Number	2
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Multichip modules Cooling Electronic packaging thermal management Insulated gate bipolar transistors Inductance power module Automotive power converter integrated cooling power electronics packaging
Content Type	Text
Resource Type	Article
Subject	Energy Engineering and Power Technology Electrical and Electronic Engineering

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