NDLI: A Versatile Timing Microsystem Based on Wafer-Level Packaged XTAL/BAW Resonators With Sub-<formula formulatype=inline><tex Notation=TeX>$mu$</tex> </formula>W RTC Mode and Programmable HF Clocks

Content Provider	IEEE Xplore Digital Library
Author	Ruffieux, D. Scolari, N. Giroud, F. Thanh-Chau Le Dalla Piazza, S. Staub, F. Zoschke, K. Manier, C.-A. Oppermann, H. Suni, T. Dekker, J. Allegato, G.
Copyright Year	1966
Abstract	This paper introduces and demonstrates with high yield a novel concept for the packaging under vacuum of tuning fork quartz XTALs on top of a silicon interposer equipped with TSVs. It paves the way to the implementation of a monolithic timing microsystem where the ASIC is part of the housing of a newly designed tiny 131-kHz XTAL to reach extreme module miniaturization (1.5 × 1.1 × 0.7 mm ³) and integrity. As this task is still ongoing, an early demonstration of the generic versatile timing module is presented using a chip-on-board approach with standalone conventionally packaged XTAL and BAW resonators. The module achieves 0.4 μW power dissipation and ±2 ppm stability over -40 °C to 85 °C in RTC mode and can deliver on-demand programmable clocks between 1-50 MHz. The latter are obtained either with a RC PLL or after division of the signal obtained from a 2-GHz BAW DCO at a power dissipation of 100 μW and 5.3 mW, respectively.
Sponsorship	IEEE Solid-State Circuits Society IEEE Electron Devices Society IEEE Circuits and Systems Society Japan Society of Applied Physics (JSAP) IEEE Microwave Theory and Techniques Society IEEE San Francisco Section Bay Area Council Univ. PA IEEE
Starting Page	212
Ending Page	222
Page Count	11
File Size	2627971
File Format	PDF
ISSN	00189200
Volume Number	49
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Oscillators Temperature sensors Clocks Timing Gold Silicon Packaging wafer level packaging Hybrid integration MEMS oscillator programmable clocks real-time clock (RTC) temperature sensor
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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