NDLI: New approach to evaluate area-dependent breakdown characteristics of dielectric polymer films

Content Provider	IEEE Xplore Digital Library
Author	Rytoluoto, I. Lahti, K.
Copyright Year	1994
Abstract	A new dielectric breakdown measurement method for determining breakdown characteristics of polymer films has been developed and evaluated. The method is based on measurement of multiple breakdowns per sample area beyond the weakest point of the film by utilizing low-energy self-healing breakdown of metallized polymer film. A data selection process based on the discharge energy characteristics of each measured self-healing breakdown is utilized prior to the statistical analysis in order to validate the mutual independence of the results. Even with a relatively small sample area, the method yields a large amount of breakdown data from a wide voltage spectrum, thus enabling the formation of detailed material-specific breakdown fingerprints. The measurement system and the area dependence of the breakdown results have been evaluated with capacitor-grade metallized film. For the statistical analysis, additively mixed Weibull distributions are utilized as multiple breakdown mechanisms are found to be operative in the dielectric. Defects in the dielectric volume are found to have a profound effect on the structure of the mixed distribution with increasing area.
Sponsorship	National Natural Science Foundation of China (NSFC) Region Centre Ville de Tours Conseil General D'Indre et Loire ABB IEEE Sandia National Laboratories TOSHIBA
Starting Page	937
Ending Page	946
Page Count	10
File Size	3323599
File Format	PDF
ISSN	10709878
Volume Number	20
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Films Discharges (electric) Dielectric measurement Breakdown voltage Voltage measurement Capacitance mixed Weibull distribution Dielectric breakdown metallized film self-healing statistical analysis
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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