NDLI: Electroplating Characteristics of Sn–Bi Microbumps for Low-Temperature Soldering

Content Provider	IEEE Xplore Digital Library
Author	Myong-Hoon Roh Jae Pil Jung Wonjoong Kim
Copyright Year	2011
Abstract	In this paper, the characteristics of eutectic Sn-Bi microsolder bumps fabricated by electroplating are investigated. The underbump metallization (UBM) layers on a Si chip consist of Al, Cu, Ni, and Au, sequentially from bottom to top. The desired Sn-Bi bump size has a diameter of 22 μm and pitch of 44 μm. In order to obtain the optimal conditions for the eutectic Sn-Bi solder bumps, the polarization curves of Sn, Bi, and Sn-Bi electrolytes are analyzed, and the variation of the Sn- Bi composition as a function of the current density is measured. Experimentally, from the polarization curve, Bi and Sn start to deposit below -0.12 and -0.54 V, respectively, and Sn-Bi codeposition occurs below an electropotential of -0.54 V. The Bi content of the electroplated bumps decreases from 92.4 to 38.2 wt% when the current density is increased from 20 to 50 mA/cm², and near-eutectic composition of the Sn-61 wt% Bi bump is obtained by plating at 40 mA/cm² for 5 min. The surface of the Sn-Bi microsolder bumps show plate-like structures with acicular shapes, and the grain size increases with increasing current density. An intermetallic compound layer, estimated as AuSn⁴ with a thickness of about 0.5 μm, was observed between the UBM layers and the as-plated Sn-Bi bumps.
Starting Page	566
Ending Page	573
Page Count	8
File Size	1787971
File Format	PDF
ISSN	21563950
Volume Number	3
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Current density Bismuth Tin Electric potential Shape Standards solder bump electroplating eutectic Sn–Bi polarization curve
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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