NDLI: A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits

Content Provider	IEEE Xplore Digital Library
Author	Harris, T.R. Priyadarshi, S. Melamed, S. Ortega, C. Manohar, R. Dooley, S.R. Kriplani, N.M. Davis, W.R. Franzon, P.D. Steer, M.B.
Copyright Year	2011
Abstract	A transient electrothermal simulation of a 3-D integrated circuit (3DIC) is reported that uses dynamic modeling of the thermal network and hierarchical electrothermal simulation. This is a practical alternative to full transistor electrothermal simulations that are computationally prohibitive. Simulations are compared to measurements for a token-generating asynchronous 3DIC clocking at a maximum frequency of 1 GHz. The electrical network is based on computationally efficient electrothermal macromodels of standard and custom cells. These are linked in a physically consistent manner with a detailed thermal network extracted from an OpenAccess layout file. Coupled with model-order reduction techniques, hierarchical dynamic electrothermal simulation of large 3DICs is shown to be tractable, yielding spatial and temporal selected transistor-level thermal profiles.
Starting Page	660
Ending Page	667
Page Count	8
File Size	1070370
File Format	PDF
ISSN	21563950
Volume Number	2
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-04-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit modeling Transient analysis Heating Thermal resistance Computational modeling Thermal analysis Analytical models transient analysis 3DIC electrothermal effects thermal management
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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