NDLI: Built-In Self-Repair Scheme for the TSVs in 3-D ICs

Content Provider	IEEE Xplore Digital Library
Author	Yu-Jen Huang Jin-Fu Li
Copyright Year	1982
Abstract	3-D integration using through-silicon-via (TSV) has been widely acknowledged as one future integrated-circuit (IC) technology. Test and yield are two big issues for volume production of 3-D ICs. In this paper, we propose a built-in self-repair (BISR) scheme to test and repair TSVs in 3-D ICs. The BISR scheme, arranging the TSVs into arrays similar to memories, can effectively enhance the yield of TSVs in a 3-D IC such that the yield of the 3-D IC is boosted. Furthermore, a global fusing methodology is proposed to reduce the requirement of fuses. Simulation and analysis results show that the proposed BISR scheme can drastically reduce the area cost and test time in comparison with an existing TSV repair scheme for the same final yield of TSVs under repair. For a 3-D wide-IO DRAM with 512 TSVs, for example, the proposed repair scheme can achieve 32.4% area reduction and 73.4% test time reduction.
Sponsorship	IEEE Council on Electronic Design Automation IEEE Circuits and Systems Society
Starting Page	1600
Ending Page	1613
Page Count	14
File Size	8934914
File Format	PDF
ISSN	02780070
Volume Number	31
Issue Number	10
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-10-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Through-silicon vias Maintenance engineering Redundancy Circuit faults Fuses Built-in self-test through-silicon-via (TSV) 3-D integrated circuit (IC) built-in self-repair (BISR) built-in self-test fuse
Content Type	Text
Resource Type	Article
Subject	Computer Graphics and Computer-Aided Design Electrical and Electronic Engineering Software

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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