NDLI: A Novel Low Area Overhead Direct Adaptive Body Bias (D-ABB) Circuit for Die-to-Die and Within-Die Variations Compensation

Content Provider	IEEE Xplore Digital Library
Author	Mostafa, H. Anis, M. Elmasry, M.
Copyright Year	1993
Abstract	A direct adaptive body bias (D-ABB) circuit is proposed in this paper. The D-ABB is used to compensate for die-to-die (D2D) and within-die (WID) parameter variations, and accordingly, improves the circuit yield regarding the speed, the dynamic power, and the leakage power. The D-ABB circuit consists of threshold voltage estimation circuits and direct control of the body bias performed by on-chip direct controller circuits. Circuit level simulation results of a circuit block case study, extracted from a real microprocessor critical path, referring to an industrial hardware-calibrated 65-nm CMOS technology transistor model, are presented. These results show that the proposed D-ABB reduces the standard deviations of the frequency, the dynamic power, and the leakage power by factors of 5.5×, 6.4×, and 4.5×, respectively, when both D2D and WID variations are considered. In addition, in the presented case study, initial total yields of 16.8% and 13% are improved to 100% and 91.4%, respectively. The proposed D-ABB circuit exhibits lower area overhead compared to the other ABB circuits reported in the literature.
Sponsorship	IEEE Computer Society Association for Computing Machinery (ACM)/SIGDA IEEE Computer Society Technical Committee on Design Automation
Starting Page	1848
Ending Page	1860
Page Count	13
File Size	1164546
File Format	PDF
ISSN	10638210
Volume Number	19
Issue Number	10
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-10-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Threshold voltage MOSFETs Sensors CMOS integrated circuits CMOS technology yield improvement Adaptive body bias (ABB) die-to-die (D2D) microprocessors process variations compensation within-die (WID)
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering Software Hardware and Architecture

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