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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Yulei Zhang Xiang Hu Deutsch, A. Engin, A.E. Buckwalter, J.F. Chung-Kuan Cheng |
| Copyright Year | 1993 |
| Abstract | As process technology scales, numerous interconnect schemes have been proposed to mitigate the performance degradation caused by the scaling of on-chip global wires. In this paper, we review current on-chip global interconnect structures and develop simple models to analyze their architecture-level performance. We propose a general framework to design and optimize a new category of global interconnect based on on-chip transmission line (T-line) technology. We perform a group of experiments using six different global interconnection structures to discover their differences in terms of latency, energy per bit, throughput, area, and signal integrity over several technology nodes. Our results show that T-line structures have the potential to outperform conventional repeated RC wires at future technology nodes to achieve higher performance while using less power and improving the reliability of wire communication. Our results also show that on-chip equalization is helpful to improve throughput, signal integrity, and power efficiency. |
| Sponsorship | IEEE Computer Society Association for Computing Machinery (ACM)/SIGDA IEEE Computer Society Technical Committee on Design Automation |
| Starting Page | 1154 |
| Ending Page | 1166 |
| Page Count | 13 |
| File Size | 1783633 |
| File Format | |
| ISSN | 10638210 |
| Volume Number | 19 |
| Issue Number | 7 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-07-01 |
| Publisher Place | U.S.A. |
| Access Restriction | One Nation One Subscription (ONOS) |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Wire Delay Power system interconnection Repeaters Throughput Power transmission lines System-on-a-chip Intersymbol interference Degradation Performance analysis transmission line On-chip global interconnect passive equalization performance prediction |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electrical and Electronic Engineering Software Hardware and Architecture |
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