NDLI: Volume Shrinkage Characterization of Underfill Materials

Content Provider	IEEE Xplore Digital Library
Author	Shang-Shiuan Deng Chia-Yi Ho Huei-Huang Lee Sheng-Jye Hwang Durn-Yuan Hwang
Copyright Year	2011
Abstract	In general, different coefficients of thermal expansion (CTE) values of constitutive materials are considered as the main cause of warpage for flip chip packages. Accordingly, during the past years, the cure-induced volume shrinkage in integrated circuit packages has been neglected in warpage simulation. However, in recent years, there are more and more evidences showing that it is not sufficient to predict the amount of warpage if considering only the CTE values of different component materials in a package especially after molding. There have been some reports about cure induced shrinkage for EMC materials. However, there is no cure induced volume shrinkage report about underfill materials. In this study, the behavioral evolution of volume shrinkage of underfill material during curing process was described by a pressure-volume-temperature-cure (P-V-T-C) equation. The P-V-T-C equation of the underfill material was developed by employing the thermal analyzer, dilatometer and statistical technique. Three successive procedures were conducted for the measurement of the P-V-T-C relation. First, the reaction kinetics and isothermal conversion of the underfill were determined by employing DSC and statistical technique. Second, isobaric and isothermal volume shrinkage of underfill was monitored with a pressure-temperature-controlled dilatometer. Third, the P-V-T-C equation was established by combining the data of volume shrinkage and conversion.
Starting Page	76
Ending Page	82
Page Count	7
File Size	710165
File Format	PDF
ISSN	21563950
Volume Number	1
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Materials Mathematical model Equations Temperature measurement Isothermal processes Volume measurement Curing warpage Cure-induced shrinkage flip chip package pressure-volume-temperature-cure (P-V-T-C) equation underfill
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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