NDLI: Energy-Optimal Dynamic Thermal Management: Computation and Cooling Power Co-Optimization

Content Provider	IEEE Xplore Digital Library
Author	Donghwa Shin Sung Woo Chung Eui-Young Chung Naehyuck Chang
Copyright Year	2005
Abstract	Conventional dynamic thermal management (DTM) assumes that the thermal resistance of a heat-sink is a given constant determined at design time. However, the thermal resistance of a common forced-convection heat sink is inversely proportional to the flow rate of the air or coolant at the expense of the cooling power consumption. The die temperature of the silicon devices strongly affects its leakage power consumption and reliability, and it can be changed by adjusting the thermal resistance of the cooling devices. Different from conventional DTM which aims to avoid the thermal emergency, our proposed DTM regards the thermal resistance of a forced-convection heat sink as a control variable, and minimize the total power consumption both for computation and cooling. We control the cooling power consumption together with the microprocessor clock frequency and supply voltage, and track the energy-optimal die temperature. Consequently, we reduce a significant amount of the temperature-dependent leakage power consumption of the microprocessor while spending a bit higher cooling power than conventional DTM, and eventually consume less total power. Experimental results show the proposed DTM saves up to 8.2% of the total energy compared with a baseline DTM approach. Our proposed DTM also enhances the Failures in Time (FIT) up to 80% in terms of the electromigration lifetime reliability.
Sponsorship	IEEE Industrial Electronics Society
Starting Page	340
Ending Page	351
Page Count	12
File Size	1230473
File Format	PDF
ISSN	15513203
Volume Number	6
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-08-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal management Energy management Cooling Thermal resistance Energy consumption Thermal force Heat sinks Thermal variables control Temperature control Microprocessors temperature-dependent leakage power Dynamic thermal management (DTM) heat sink liquid cooling reliability
Content Type	Text
Resource Type	Article
Subject	Control and Systems Engineering Information Systems Electrical and Electronic Engineering Computer Science Applications

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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