NDLI: Large-Scale Silicone-Rubber-Based Optical Interconnect Packaged With FR4

Content Provider	IEEE Xplore Digital Library
Author	Dengke Cai Neyer, A.
Copyright Year	1992
Abstract	Polydimethylsiloxane (PDMS)-based large-scale electrical-optical circuit boards (EOCBs) have been developed based on a combination of a large-scale PDMS waveguide fabrication technique and a process for efficient interfacial bonding between PDMS optical layers and standard FR4 (fiberglass-reinforced epoxy and grade 4 on flame retardance) printed circuit board materials using a specially developed surface adhesion promoter (SAP). The main mechanism of forming a good bonding between PDMS and FR4 has been identified. The optical properties of the PDMS waveguide layer remained unchanged by the addition of the SAP. According to the defined test procedures from the Institute of Printed Circuits, the International Electro Technical Commission, and Telcordia, the environmental stability of packaged EOCBs has been tested with the result that they exhibited excellent mechanical, optical, and thermal stabilities. The mechanical stability limit of the tested EOCBs is determined only by the intrinsic mechanical stability of the used PDMS materials. The optical waveguide propagation loss at 850 nm is less than 0.1 dB/cm after surviving from the defined environmental test procedures.
Sponsorship	IEEE Electron Devices Society American Society of Mechanical Engineering (ASME)
Starting Page	1362
Ending Page	1369
Page Count	8
File Size	1128996
File Format	PDF
ISSN	10577157
Volume Number	19
Issue Number	6
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-12-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fabrication Surface treatment Substrates Optical interconnections Optical device fabrication Printed circuits Packaging polydimethylsiloxane (PDMS) Environmental stability interface adhesion large scale optical interconnect packaging
Content Type	Text
Resource Type	Article
Subject	Mechanical Engineering Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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