NDLI: Tin Whisker Test Development—Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection

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Tin Whisker Test Development—Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection

Content Provider	IEEE Xplore Digital Library
Author	Reynolds, H.L. Osenbach, J.W. Henshall, G. Parker, R.D. Peng Su
Copyright Year	1999
Abstract	The effects of temperature and humidity on tin whisker growth were investigated through a collaborative project sponsored by the International Electronics Manufacturing Initiative (iNEMI) and its member companies. A broad range of testing conditions was adopted to test a variety of components with matte tin (Sn) plating and copper (Cu)-based leadframes. The primary goal of the study was to collect data that could be used to develop mathematical models (acceleration functions) that describe the dependence of tin whisker growth and corrosion on temperature and humidity. This paper describes the background, experimental design, data collection and reports results. Part II of the study (J. W. Osenbach et a. ?Tin whisker test development-Temperature and humidity effects part II: Acceleration model development,? Electronics Packaging Manufacturing, Vol. 33, no. 1, pp., Jan. 2010) discusses in the data analyses and acceleration model development. Storage testing was performed over a wide range of temperature and humidity conditions from 30?C to 100?C and from 10% to 90% relative humidity (RH). Commercially produced components with both 3 ?m and 10 ?m thicknesses from three sources were evaluated. For components with the 10 ?m-plating, the plating was evaluated in both the as-plated and reflowed (260?C) conditions. These variations resulted in a large experimental matrix that included 13 different Sn platings, aged at ten different temperature and humidity combinations. Further, the aging test was done at five different laboratories with inspections performed at eight different laboratories. The data collected include 1) corrosion incubation time, 2) tin whisker incubation time, and 3) dependence of the maximum whisker length on storage time at each temperature/humidity condition. Data suggest that corrosion is not a unique driving force for whisker initiation and growth. Whisker formation differs in corroded and non-corroded regions. Due to the scope of this work, it is broken down into two papers. The data and experimental observations are discussed in this paper. The mathematical model development, discussion of results and conclusions are included in Part II of this study.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society International Microelectronics Assembly and Packaging Society (IMAPS)
Starting Page	1
Ending Page	15
Page Count	15
File Size	5386589
File Format	PDF
ISSN	1521334X
Volume Number	33
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-01-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Tin Testing Humidity Design for experiments Corrosion Manufacturing Mathematical model Acceleration Temperature dependence Performance evaluation tin whisker humidity storage Pb-free surface finish temperature storage testing tin plating
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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