NDLI: Low-Loss Chip-to-Chip Optical Interconnection Using Multichip Optoelectronic Package With 40-Gb/s Optical I/O for Computer Applications

Content Provider	IEEE Xplore Digital Library
Author	Takagi, Y. Suzuki, A. Horio, T. Ohno, T. Kojima, T. Takada, T. Iio, S. Obayashi, K. Okuyama, M.
Copyright Year	1983
Abstract	We have developed novel optoelectronic packages and optical transmission system using an optical connector with an external optical waveguide to achieve low-loss chip-to-chip optical interconnections for computer systems. In order to connect the package and the connector, we have also proposed a socket as a coupling structure to realize an all passive alignment and high coupling efficiency. We have demonstrated high-speed and error-free signal transmission with four channels at 10-Gb/s/ch and up to 12-Gb/s/ch. Optical input and output (I/O) interfaces, including optical devices and controller integrated circuits (ICs), have been constructed onto the package surface by conventional flip-chip mounting. The optoelectronic package has optical waveguide holes (OWGHs) to pass optical signal vertically from a vertical-cavity surface-emitting laser (VCSEL) and to a photodiode (PD). The OWGHs consist of core and cladding material to enhance optical confinement. The optical connector that is just set underneath the package with two guide pins contains the thin-film polymer waveguide with 45°-ended mirrors to bend the optical signal. Therefore, the shorter optical coupling distance has achieved low-loss optical link without microlenses between packages. We have also proposed an alignment structure to easily enable passive alignment, which is based on existing land grid array (LGA) packages and sockets clamping structures to simultaneously improve cost-competitiveness and usability.
Sponsorship	IEEE Lasers and Electro-Optics Society Optical Society of America
Starting Page	2956
Ending Page	2963
Page Count	8
File Size	1132945
File Format	PDF
ISSN	07338724
Volume Number	28
Issue Number	20
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-10-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Optical waveguides High speed optical techniques Optical device fabrication Optical coupling Integrated optics Optical interconnections passive alignment structures Computer applications optical interconnections optoelectronic packages optical waveguide holes (OWGHs)
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics

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