NDLI: Study of Flip Chip Solder Joint Cracks Under Temperature Cycling Using a Laser Ultrasound Inspection System

Content Provider	IEEE Xplore Digital Library
Author	Lizheng Zhang Ume, I.C. Gamalski, J. Galuschki, K.-P.
Copyright Year	1999
Abstract	The current techniques for nondestructive quality evaluation of bumped solder joint connections in electronics packages are either incapable of detecting solder joint cracks, or unsuitable for inline inspection due to cost and throughput reasons. As an alternative, a novel solder joint inspection system is being developed. The system projects short laser pulses onto specimen surface through optic fibers to induce structural vibration. The induced surface displacements are then measured by a laser Doppler vibrometer. A number of digital signal processing algorithms, such as error ratio and correlation coefficient, were used to analyze the vibration responses and identify defective specimens. This paper presents a systematic study of parameters such as error ratio, correlation coefficient, resonant frequency, electrical resistance, and the extension of solder joint cracks, to quantitatively characterize the relationships among them. These relationships verified that the laser ultrasound inspection system provides a reliable and efficient way to evaluate flip chip solder joint cracks nondestructively.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	120
Ending Page	126
Page Count	7
File Size	948222
File Format	PDF
ISSN	15213331
Volume Number	32
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-03-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Flip chip solder joints Temperature Ultrasonic imaging Inspection Soldering Fiber lasers Surface cracks Surface emitting lasers Electronics packaging Costs temperature cycling Laser ultrasound inspection solder joint cracks
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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