NDLI: Stacking chips in 3D

Content Provider	IEEE Xplore Digital Library
Copyright Year	1984
Description	3D IC solutions have been developed for several different reasons: to reduce the system form factor for portable platforms; to increase system performance by alleviating the interconnect-delay bottleneck; and to manage overall system cost by stacking heterogeneous chips, rather than integrate diverse system components into a single chip through 2D scaling. However, although some 3D IC markets are emerging, and most technical issues of 3D integration are almost solved, several thermal and production-test challenges remain as obstacles. This special issue of IEEE Design & Test takes a look a those issues.
Sponsorship	IEEE Computer Society
Starting Page	2
Ending Page	2
Page Count	1
File Size	407009
File Format	PDF
ISSN	07407475
Volume Number	26
Issue Number	5
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE) Computer Society
Publisher Date	2009-01-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Stacking Three-dimensional integrated circuits Production Semiconductor device testing Hardware Propulsion System performance Costs Research and development Semiconductor device measurement interconnect-delay bottleneck 3D IC design and test integration
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering Software Hardware and Architecture

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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