NDLI: Modeling and Experimental Testing of Strain Gauges in Operational and Failure Modes

Content Provider	IEEE Xplore Digital Library
Author	Ellis, B.L. Smith, L.M.
Copyright Year	1963
Abstract	Strain gauges are resistive sensors bonded at critical locations on the surface of structural components to detect surface deformation and, thus, measure mechanical stress. However, strain gauges do not always report expected measurements, even under normal operating conditions. The primary goals of this paper were to develop predictive models for strain-gauge behavior and experimentally test them under controlled laboratory settings. A testing station was developed that generated a mechanical motion on a beam, subjecting strain gauges to a sinusoidally varying strain. Predictive models of the testing station were developed and experimentally analyzed. Models were also developed for two particular failure modes, namely, debonding and wire lead termination. For the cases studied, the models overpredict the output of a strain gauge operating under normal conditions, which is a discrepancy that can be explained by the gauge modifying the surface properties of the test component. Models for debonding and loose lead show agreement in terms of reduction in signal amplitude and histogram modification, respectively. Calculated and experimental data are presented that show characteristic signals in terms of time domain and histogram analysis.
Sponsorship	IEEE Instrumentation and Measurement Society Bureau international des poids et mesures IEEE International Bureau of Weights and Measures (BIPM) URSI NBS Agency Ind. Sci. & Technol., Min. Int. Trade & Ind. Sci. Council Japan International Union of Pure and Applied Physics (IUPAP) NIST NRCC National Conference of Standards Laboratories (NCSL) Allen Osborne Associates Andeen-Hagerling, Inc. Ballantine Lab. Inc. Clarke-Hess Communications Research Corp. Fluke Corporation Guildline Instruments Hewlett-Packard Co. Julie Res. Lab. Inc. Keithley Instruments, Inc. Measurements International Ltd. Canada QuadTech Inc. Quantum Design Inc. Rotek Instrum. Corp. Tegam Inc. Tektronix Inc
Starting Page	2222
Ending Page	2227
Page Count	6
File Size	615828
File Format	PDF
ISSN	00189456
Volume Number	58
Issue Number	7
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-07-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Testing Capacitive sensors Strain measurement Predictive models Histograms Mechanical sensors Bonding Mechanical variables measurement Stress measurement Strain control strain measurement Failure analysis fatigue modeling strain
Content Type	Text
Resource Type	Article
Subject	Instrumentation Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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