NDLI: Diffusivity of Cu Ions in Solid Electrolyte and Its Effect on the Performance of Nanometer-Scale Switch

Content Provider	IEEE Xplore Digital Library
Author	Banno, N. Sakamoto, T. Iguchi, N. Sunamura, H. Terabe, K. Hasegawa, T. Aono, M.
Copyright Year	1963
Abstract	A novel solid-electrolyte nonvolatile switch that we previously developed for programmable large-scale-integration circuits turns on or off when a conducting Cu bridge is formed or dissolved in the solid electrolyte. Cu⁺ ion migration and an electrochemical reaction are involved in the switching process. For logic applications, we need to adjust its turn-on voltage (V _ON), which was too small to maintain the conductance state during logic operations. In this paper, we clarified that V _ON is mainly affected by the rate of Cu⁺ ion migration in the solid electrolyte. Considering the relationship between the migration rate and V _ON, we replaced the former electrolyte, Cu_2-alphaS, with Ta₂O₅, which enabled us to appropriately adjust V _ON with a smaller Cu⁺ ion diffusion coefficient.
Sponsorship	IEEE Electron Devices Society
Starting Page	3283
Ending Page	3287
Page Count	5
File Size	846828
File Format	PDF
ISSN	00189383
Volume Number	55
Issue Number	11
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-11-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Copper Switches Programmable logic devices Ions switches Electrochemical devices ions programmable logic device
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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