NDLI: Laser Ablated Micromirrors for Printed Circuit Board Integrated Optical Interconnections

Content Provider	IEEE Xplore Digital Library
Author	Hendrickx, N. Van Erps, J. Van Steenberge, G. Thienpont, H. Van Daele, P.
Copyright Year	1989
Abstract	Optical interconnections offer a possible solution to the bandwidth problems associated with future electrical interconnections. Optics has proven its potential for long-haul communication networks, where it is today a well accepted standard. The integration towards shorter distances is challenging. Compatibility with technologies used in printed circuit board manufacturing is required to implement optical interconnections on board-level in the near future in a cost-effective way. Especially coupling structures, which are used to deflect the light beam over 90deg, pose problems. We propose the use of metallized 45deg micromirrors which are fabricated with the use of laser ablation. This letter gives an overview of the fabrication process and shows experimental results. The root-mean-square surface roughness of the mirror facet is 70 nm or better, depending on the used polymer material. The 45deg angle can be ablated with an accuracy of plusmn1 deg and has a high reproducibility. The mechanical properties of the micromirrors were maintained after a Telcordia 85/85 stability test
Sponsorship	IEEE Lasers and Electro-Optics Society
Starting Page	822
Ending Page	824
Page Count	3
File Size	494233
File Format	PDF
ISSN	10411135
Volume Number	19
Issue Number	11
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-06-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Micromirrors Printed circuits Optical interconnections Bandwidth Integrated circuit interconnections Optical fiber networks Communication networks Communication standards Integrated circuit technology Manufacturing optical interconnections Coupling structures laser ablation micromirrors
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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