NDLI: Nonuniformity of Wafer and Pad in CMP: Kinematic Aspects of View

Content Provider	IEEE Xplore Digital Library
Author	Tyan Feng
Copyright Year	1988
Abstract	In this paper, we analyze the nonuniformity of sliding distance on both the wafer and polishing pad from a kinematic point of view. Using the Fourier series expansion, it can be shown that in steady state the nonuniformity caused by contact relative velocity is determined by rotational speed ratio between platen and wafer carrier (m) and the ratio of wafer radius to the distance between the platen center and wafer center (R_c/d). In general, the nonuniformity of wafer increases with \|m\| and (R_c/d). An important observation for the polishing pad is that in two particular ranges of the ratio m, larger (R_c/d) on the contrary yields smaller nonuniformity. Then, a ring-type polishing pad is proposed for the purpose of improving the nonuniformity of both wafer and pad. However, it turns out the result for the pad of large size is worse than the traditional shape, unless the rotational speed of the pad is much slower than that of the wafer.
Sponsorship	IEEE Electron Devices Society IEEE Components, Packaging, and Manufacturing Technology Society IEEE Reliability Society IEEE Solid-State Circuits Society
Starting Page	451
Ending Page	463
Page Count	13
File Size	3235580
File Format	PDF
ISSN	08946507
Volume Number	20
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-11-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Kinematics Equations Planarization Slurries Chemistry Position measurement Velocity measurement Semiconductor materials Fourier series Steady-state sliding distance Chemical–mechanical polishing (CMP) nonuniformity Preston equation ring-type polishing pad
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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