NDLI: Deformation Behavior of MEMS Gyroscope Sensor Package Subjected to Temperature Change

Content Provider	IEEE Xplore Digital Library
Author	Jin-Won Joo Sung-Hoon Choa
Copyright Year	1999
Abstract	In microelectromechanical system (MEMS) devices, the deformation of MEMS structure caused by packaging induced stress is of great concern since it directly affects the performance of the device. In this paper, deformation behavior of the MEMS gyroscope package subjected to temperature change is investigated using a high-sensitivity moire interferometry. Temperature dependent analyses of warpage and extension/contraction of the package are presented. Analysis of the package reveals that global bending deformation occurs due to the mismatch of the coefficient of thermal expansion between the chip, the molding compound, and the printed circuit board. Detailed global and local deformations of the package by temperature change are investigated, and their effect on the frequency shift of the MEMS gyroscope is studied. It is found that package deformation or package induced stress results in the frequency shift of the MEMS gyroscope structure. In order to increase robustness of the structure against deformation, a "crab-leg" type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. This frequency shift is within the tolerance limit of the gyroscope sensor in this work
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	346
Ending Page	354
Page Count	9
File Size	2317275
File Format	PDF
ISSN	15213331
Volume Number	30
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-06-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature sensors Micromechanical devices Gyroscopes Packaging Frequency Springs Microelectromechanical systems Stress Interferometry Temperature dependence thermo-mechanical behavior Board level package displacement measurement microelectromechanical system (MEMS) gyroscope package Moiré interferometry
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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