NDLI: Assessment of Thermomechanical Damage of Electronic Parts Due to Solder Dipping as a Postmanufacturing Process

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IEEE Components, Packaging, and Manufacturing Technology Society Information for authors

IEEE Components, Packaging, and Manufacturing Technology Society Information

Issue 1

Year : 2006 Volume : 29

Year : 2005 Volume : 28

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Year : 1999 Volume : 22

Assessment of Thermomechanical Damage of Electronic Parts Due to Solder Dipping as a Postmanufacturing Process

Content Provider	IEEE Xplore Digital Library
Author	Sengupta, S. Das, D. Ganesan, S. Rollins, W. Pinsky, D. Lin, T.Y. Pecht, M.G.
Copyright Year	1999
Abstract	Tin whiskering is a concern with tin-rich alloy finishes on electronic part terminations. Solder dipping may be used to replace the original finish with eutectic tin-lead solder for tin-whiskering risk mitigation purposes. However, the solder dipping process may expose electronic parts to thermomechanical damage within the package due to the thermal refinishing profile used during dipping. This paper discusses solder dipping as a refinishing technique and the associated risks from thermomechanical damage. An experimental study was used to assess the possibility of thermomechanical damage on various electronic part-types of different package configurations. Package and die geometries were characterized for all part-types to develop quantitative metrics, which may be used by electronic part users to assess parts for their susceptibility to thermomechanical damage.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society International Microelectronics Assembly and Packaging Society (IMAPS)
Starting Page	128
Ending Page	137
Page Count	10
File Size	1160713
File Format	PDF
ISSN	1521334X
Volume Number	30
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-04-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermomechanical processes Tin Environmentally friendly manufacturing techniques Lead Electronic packaging thermal management Electronic equipment Mechanical engineering Packaging machines Legislation Process control tin whisker Component reliability delamination restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) exemption solder dipping
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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