NDLI: 60 GHz Single-Chip Front-End MMICs and Systems for Multi-Gb/s Wireless Communication

Content Provider	IEEE Xplore Digital Library
Author	Gunnarsson, S.E. Karnfelt, C. Zirath, H. Kozhuharov, R. Kuylenstierna, D. Fager, C. Ferndahl, M. Hansson, B. Alping, A. Hallbjorner, P.
Copyright Year	1966
Abstract	Single-chip 60 GHz transmitter (TX) and receiver (RX) MMICs have been designed and characterized in a 0.15mum (f_T~ 120 GHz/f _MAX> 200 GHz) GaAs mHEMT MMIC process. This paper describes the second generation of single-chip TX and RX MMICs together with work on packaging (e.g., flip-chip) and system measurements. Compared to the first generation of the designs in a commercial pHEMT technology, the MMICs presented in this paper show the same high level of integration but occupy smaller chip area and have higher gain and output power at only half the DC power consumption. The system operates with a LO signal in the range of 7-8 GHz. This LO signal is multiplied in an integrated multiply-by-eight (X8) LO multiplier chain, resulting in an IF center frequency of 2.5 GHz. Packaging and interconnects are discussed and as an alternative to wire bonding, flip-chip assembly tests are presented and discussed. System measurements are also described where bit error rate (BER) and eye diagrams are measured when the presented TX and RX MMICs transmits and receives a modulated signal. A data rate of 1.5 Gb/s with simple ASK modulation was achieved, restricted by the measurement setup rather than the TX and RX MMICs. These tests indicate that the presented MMICs are especially well suited for transmission and reception of wireless signals at data rates of several Gb/s
Sponsorship	IEEE Solid-State Circuits Society IEEE Electron Devices Society IEEE Circuits and Systems Society Japan Society of Applied Physics (JSAP) IEEE Microwave Theory and Techniques Society IEEE San Francisco Section Bay Area Council Univ. PA IEEE
Starting Page	1143
Ending Page	1157
Page Count	15
File Size	3449319
File Format	PDF
ISSN	00189200
Volume Number	42
Issue Number	5
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-05-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	MMICs Wireless communication Packaging Power generation Testing Bit error rate Transmitters Gallium arsenide mHEMTs Semiconductor device measurement V-band 60 GHz flip-chip GaAs highly integrated image rejection mHEMT MMIC multi-functional packaging receiver RFIC RX single-chip transmitter TX
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Highly integrated 60 GHz transmitter and receiver MMICs in a GaAs pHEMT technology

Single-Chip 220-GHz Active Heterodyne Receiver and Transmitter MMICs With On-Chip Integrated Antenna

A 243 GHz LNA Module Based on mHEMT MMICs With Integrated Waveguide Transitions

A 220 GHz Single-Chip Receiver MMIC With Integrated Antenna

A 2.2-V operation, 2.4-GHz single-chip GaAs MMIC transceiver for wireless applications

A 210 GHz Fully-Integrated OOK Transceiver for Short-Range Wireless Chip-to-Chip Communication in 40 nm CMOS Technology

A single-chip GaAs MMIC image-rejection front-end for digital European cordless telecommunications

28 GHz Single-Chip Transmit RF Front-End MMIC for Multichannel 5G Wireless Communications

A Compact 60-GHz Transmitter--Receiver

60 GHz Single-Chip Front-End MMICs and Systems for Multi-Gb/s Wireless Communication

Similar Documents

Highly integrated 60 GHz transmitter and receiver MMICs in a GaAs pHEMT technology

Single-Chip 220-GHz Active Heterodyne Receiver and Transmitter MMICs With On-Chip Integrated Antenna

A 243 GHz LNA Module Based on mHEMT MMICs With Integrated Waveguide Transitions

A 220 GHz Single-Chip Receiver MMIC With Integrated Antenna

A 2.2-V operation, 2.4-GHz single-chip GaAs MMIC transceiver for wireless applications

A 210 GHz Fully-Integrated OOK Transceiver for Short-Range Wireless Chip-to-Chip Communication in 40 nm CMOS Technology

A single-chip GaAs MMIC image-rejection front-end for digital European cordless telecommunications

28 GHz Single-Chip Transmit RF Front-End MMIC for Multichannel 5G Wireless Communications

A Compact 60-GHz Transmitter--Receiver

60 GHz Single-Chip Front-End MMICs and Systems for Multi-Gb/s Wireless Communication