NDLI: News Briefs

Content Provider	IEEE Xplore Digital Library
Author	Garber, L.
Copyright Year	1970
Description	IBM researchers have developed a technique that creates vacuum spaces, called airgaps, between the wires in processors using self-assembling technology. These airgaps create a form of insulation that increases the chips' performance up to 35 percent or reduces their power consumption up to 15 percent. The airgap technique lowers the chip insulator's dielectric constant, which describes a material's ability to transmit charge when a voltage is applied. Because the insulator would transmit less charge, the current introduced to other circuits would drop. Vacuums are very good insulators because they don't transmit charge well. Using airgaps between wires can lower a chip insulator's relative dielectric level to a bit below 2.0.
Sponsorship	IEEE Computer Society
File Size	161462
File Format	PDF
ISSN	00189162
Volume Number	40
Issue Number	7
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-07-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Dielectrics and electrical insulation Wires Vacuum technology Energy consumption Transistors Lithography Circuits Dielectric constant Cable insulation Computer hacking eye-tracking technology airgap technology malware Wi-Fi
Content Type	Text
Resource Type	Article
Subject	Computer Science

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