NDLI: A new polyglass banding tape

Content Provider	IEEE Xplore Digital Library
Author	Maiti, P.K.
Copyright Year	1994
Description	Polyglass banding tapes consist of parallel, non-woven, twisted and high tensile strength glass yarns that are pre-impregnated with a special thermosetting resin; the resin employed permits long self life in the semi cured tapes. The tape has replaced steel rope in large DC rotor, commutator banding and transformer leg locking to minimize eddy current, over-heating and flashover etc. The thermosetting resin has an important role in the performance of polyglass banding tapes. A new polyglass banding tape was developed with a very special thermosetting polyester resin modified with organic silicone compound. The mechanical and electrical properties of the cured banding tape were thoroughly evaluated. Special test rings were fabricated from this tape to measure the moisture resistance by the effects of immersion in boiling water on tensile strength. The accelerated thermal aging test on the flexural strength of the tape was done and the Arrhenius type plot of logarithm of time vs. inverse of absolute temperature to 20000 hours line gave its temperature class. It was observed that the new polyglass banding tape had very high thermal stability (over 220degC) as well as an excellent humidity resistance. The cured structure was a homogenous laminate with smooth, resin rich surface that offered excellent track and arc resistance. The silicone modified polyester based glass banding tape is expected to be suitable for motor and transformer operating in a tropical environment as evidenced from the sufficient resistance to moisture
Sponsorship	National Natural Science Foundation of China (NSFC) Region Centre Ville de Tours Conseil General D'Indre et Loire ABB IEEE Sandia National Laboratories TOSHIBA
Starting Page	782
Ending Page	787
Page Count	6
File Size	195051
File Format	PDF
ISSN	10709878
Volume Number	13
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-08-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Resins Glass Testing Moisture Temperature Thermal resistance Surface resistance Steel Commutation
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Study of the base material and application method on the properties of banding tape

Dakin's Corner

Effect of Moisture on Thermal Properties of Halogen-Free and Halogenated Printed-Circuit-Board Laminates

New types of optoelectronic molding compounds

Glass Jointed Alumina Vacuum Chambers

Reducing variability in inclined-plane tracking test results

Significance of the Conductor Radial Temperature Gradient within a Dynamic Line Rating Methodology

Encapsulating resins for semiconductors

Radial and Axial Temperate Gradients in Bare Stranded Condctor

A new polyglass banding tape

Similar Documents

Study of the base material and application method on the properties of banding tape

Dakin's Corner

Effect of Moisture on Thermal Properties of Halogen-Free and Halogenated Printed-Circuit-Board Laminates

New types of optoelectronic molding compounds

Glass Jointed Alumina Vacuum Chambers

Reducing variability in inclined-plane tracking test results

Significance of the Conductor Radial Temperature Gradient within a Dynamic Line Rating Methodology

Encapsulating resins for semiconductors

Radial and Axial Temperate Gradients in Bare Stranded Condctor

A new polyglass banding tape