NDLI: Modeling of 3-D Vertical Interconnect Using Support Vector Machine Regression

Content Provider	IEEE Xplore Digital Library
Author	Lei Xia Jicheng Meng Ruimin Xu Bo Yan Yunchuan Guo
Copyright Year	2001
Abstract	In this letter, the support vector machine (SVM) regression approach is introduced to model the three-dimensional (3-D) high density microwave packaging structure. The SVM is based on the structural risk minimization principle, which leads to a good generalization ability. With a 3-D vertical interconnect used as an example, the SVM regression model is electromagnetically developed with a set of training data and testing data, which is produced by the electromagnetic simulation. Experimental results suggest that the developed model performs with a good predictive ability in analyzing the electrical performance
Sponsorship	IEEE Microwave Theory and Techniques Society
Starting Page	639
Ending Page	641
Page Count	3
File Size	136795
File Format	PDF
ISSN	15311309
Volume Number	16
Issue Number	12
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Support vector machines Artificial neural networks Integrated circuit interconnections Risk management Predictive models Support vector machine classification Dielectric substrates Electromagnetic modeling Training data Testing three-dimensional (3-D) vertical interconnect Fuzz button low temperature co-fired ceramic (LTCC) support vector machine (SVM) support vector regression (SVR)
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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