NDLI: Alignment tolerance enlargement of a high-speed photodiode by a self-positioned microball lens

Content Provider	IEEE Xplore Digital Library
Author	Yun-Hsun Huang Chih-Chao Yang Te-Chin Peng Meng-Chyi Wu Ho, C.-L. Wen-Jeng Ho
Copyright Year	1989
Abstract	By integrating a commercially available microball lens on the InGaAs p-i-n photodiode chip, we have achieved at least 5- and 16-fold improvements of the optical alignment tolerance in the transverse and longitudinal axes, respectively, without sacrificing the diode efficiency. The optical alignment during lens/chip integration is achieved by a self-positioning process, which provides an on-chip ball-lens socket in concentric circles to the photodiode aperture to sustain the drop-in microball lens. The photodiode after lens integration exhibits a 3-dB bandwidth larger than 9 GHz and a responsivity larger than 0.9 A/W, both at 1310-nm wavelength. In addition, the InGaAs photodiode exhibits a dark current density of less than 3 /spl mu/A/cm/sup 2/, both before and after lens positioning, indicating a proper integration.
Sponsorship	IEEE Lasers and Electro-Optics Society
Starting Page	112
Ending Page	114
Page Count	3
File Size	209562
File Format	PDF
ISSN	10411135
Volume Number	18
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Lenses Indium gallium arsenide High speed optical techniques Integrated optics PIN photodiodes P-i-n diodes Sockets Apertures Bandwidth Dark current 10 Gb/s InGaAs microball lens p-i-n photodiode socket
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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