NDLI: Redistribution of pads on a singulated IC die using laser direct-write ablation

Content Provider	IEEE Xplore Digital Library
Author	Chengping Zhang Bartholomew, R. Karulkar, P.C.
Copyright Year	1999
Abstract	The use of laser direct-write technology is demonstrated for rapid turnaround redistribution of pads on known good integrated circuit dice. The technology, which is suitable for rapid prototyping of advanced electronic packages, employs an automated laser ablation system with wavelength at 355nm to pattern thin copper films to form the interconnect and vias in the polyimide interlevel insulator. The ablation tool is designed to directly accept the CAD data and write the metallization and via level patterns with excellent (/spl plusmn/3/spl mu/m) layer-to-layer registration. This process is maskless and, except for cleaning steps, does not require patterning by wet chemical etching. The implementation of a change in the design can be done rapidly and involves modifying the CAD data, downloading it to the laser ablation tool, and fabricating a part according to the new design. This paper illustrates the use of laser direct-write ablation for fabrication of via chain test structures and redistribution of pads on functional integrated circuits on singulated dice. Comparable electrical test results were obtained between structures fabricated using laser ablation technology and those fabricated on full 150-mm diameter wafers using conventional photolithography and etch processes.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	184
Ending Page	189
Page Count	6
File Size	1244752
File Format	PDF
ISSN	15213331
Volume Number	29
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-01-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Laser ablation Integrated circuit technology Circuit testing Design automation Optical design Chemical lasers Prototypes Electronics packaging Integrated circuit packaging Copper thin film known good die laser direct-write laser ablation pad redistribution polyimide
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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