NDLI: Interface microstructure evolution of lead-free solder on Ni-based under bump metallizations during reflow and high temperature storage

Content Provider	IEEE Xplore Digital Library
Author	Chih Hang Tung Poi Siong Teo Lee, C.
Copyright Year	2001
Abstract	The interface microstructure interaction between SnCuAg Pb-free solder and three different Ni-based alloys under bump metallization (UBM) systems are studied using transmission electron microscopy (TEM). Ni reacts with Sn-rich Pb-free solder swiftly and is consumed readily by Pb-free solder. Thermally stable intermetallic compounds at the solder/UBM interface such as Cu/sub 6/Sn/sub 5/ or Ni/sub 3/P are necessary to protect Ni from being penetrated by Pb-free solders. Interface microstructure study reveals the potential process and reliability issues when applying Pb-free solders on existing UBM systems. Cu/Ni(V)/Al, can be used for Pb-free solder with marginal thermal budget. Au/Ni(V)/Ti/Al, is not suitable for Pb-free solder. And Au/eNi(P)/Al, is the most suitable for Pb-free solder and shows best thermal stability.
Sponsorship	IEEE Electron Devices Society IEEE Reliability Society
Starting Page	212
Ending Page	216
Page Count	5
File Size	2406816
File Format	PDF
ISSN	15304388
Volume Number	5
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-06-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microstructure Environmentally friendly manufacturing techniques Lead Metallization Temperature Gold Transmission electron microscopy Intermetallic Tin Protection under bump metallization (UBM) lead-free solder packaging reliability transmission electron microscopy (TEM)
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Safety, Risk, Reliability and Quality Electrical and Electronic Engineering

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Interface microstructure evolution of lead-free solder on Ni-based under bump metallizations during reflow and high temperature storage

Mechanical Properties of Arrayed Pb-Free Tin Bump and Its Interfacial Reaction with Ni-P UBM during Reflow Process

Solder Joint Strength Of Lead Free Solders under Multiple Reflow and High Temperature Storage Condition

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Investigation of Cr/Cu/Cu/Ni under bump metallization for lead-free applications

Intermetallic reactions between lead-free SnAgCu solder and Ni(P)/Au surface finish on PWBs

Influence of Intermetallic Properties on Reliability of Lead-Free Flip-Chip Solder Joints

Investigation of Sn/Cu/Ni Ternary Alloying in Lead Free Solder Bump Applications

Low Cost UBM for Lead Free Solder Bumping with C4NP

Interface microstructure evolution of lead-free solder on Ni-based under bump metallizations during reflow and high temperature storage

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